Keiron Technologies, a startup from Eindhoven, has developed a breakthrough laser-based soldering technology that applies solder paste to printed circuit boards (PCBs) with extreme precision, replacing the need for three conventional machines. This innovation, co-developed with input from ASML engineers, significantly reduces production errors and enables greater design flexibility, allowing smaller and larger components to be placed closer together on PCBs. As a result, electronic products like phones and hearing aids can become thinner and more compact. The fully automated machine lowers production costs, supports reshoring of manufacturing to Europe, and includes real-time quality control capabilities. Backed by investors including Cottonwood Technology Fund and DeepTechXL and supported by the Brainport ecosystem, Keiron is preparing to scale rapidly, with global customer interest and eight machines slated for delivery this year.

Key Bullet Points:
▶️ Laser-based soldering: Keiron’s machine uses laser technology to apply solder paste in quantities from 1 to 2500 nanoliters, ensuring exact dosing per component size.
▶️ High precision: The system achieves a placement accuracy with a deviation of max 25%, compared to 50% with current stencil-based technology.
▶️ Operational efficiency: Integrated inspection and real-time software adjustments reduce downtime and labor needs on PCB production lines.
▶️ Design freedom: The ability to mix small and large components more closely enables more compact electronics and innovative PCB designs.
▶️ Scalable production: With manufacturing outsourced locally in Brainport, Keiron plans to scale from 8 machines in 2025 to 100 in 2027, serving customers in Europe, the UK, and the US.
▶️ Strong ecosystem support: Originating from TNO and Holst Centre research, and supported by ASML and strong local industrial players, Keiron leverages regional partnerships for growth without needing large internal production teams.